LTM has a proven IPv6 suite which resides over the Bluetooth low energy or 802.15.4 layers as transport as shown in the block diagram below.

LTM’s IPv6 suite has been built grounds up to meet the needs of embedded systems. The IPv6 suite is optimized for Memory and MIPS and implemented in ANSI C to enable portability across processor platforms. The IPv6 Suite also provides clean abstraction layers to enable it to work across operating systems and various lower layer implementations of Bluetooth low energy Host stack.

Specifically for Bluetooth low energy – The IPv6 Suite supports 6LoBTLE, IPv6, CoAP, UDP and Internet Protocol Support Profile (IPSP). This enables any individual Bluetooth capable device to be wirelessly connected and addressable over the Internet. This capability, together with the low power consumption offered by Bluetooth low energy is ideal for the wireless Internet of Things network.

To know more, view our IPv6 and Bluetooth Mesh Demo